In all likelihood, even in the new 5 nm process, this will not be possible without higher consumption, which is why the TDP in the future will be up to 170 watts, and the PPT of the socket AM5 will be up to 250 watts. The IPC could increase by 8 to 10%, with the higher clock providing additional performance. Raphael with Zen 4 is said to boost single-core performance by more than 15%. The MSI MEG X570 Godlike from 2019, the direct predecessor, still managed 16 phases and MOSFETs with 70 amps each. Some manufacturers have already introduced AM4 mainboards with a wide voltage range for the November 2020 release of Ryzen 5000 (test), but with Zen 4 on the X670E chipset, there will be another significant upgrade. It remains to be seen how the phases will be switched (addressed in groups by the VRM controller). The PCB design of the large 305 288 mm E-ATX main board reveals a powerful power supply. Wccftech mentions a '24+2+1 Phase (105A) CPU VRM Design,' as well as '105A MOSFETs' and 'Dual 8-Pin Power Connectors for CPU,' implying an upcoming spearhead in MSI's AM5 portfolio.

The MSI MEG X670E Godlike board design for AMD's upcoming Ryzen 7000 series Raphael desktop processors based on the new Zen 4 architecture reveals a very powerful voltage modulation based on a 24+2+1 phase design and 105 amp strong MOSFET.Ī media outlet obtained the expected technical specifications, drawings, and images of the MSI MEG X670E Godlike.

Ten phase VRM controller chip